Integra Technologies’ Assembly Service Guide

Integra Technologies Inc. – Assembly Service Guide

*September 2022*

Learn how to make your products cost effective and designed for manufacture through the help of this detailed guide!

Our guidelines are provided to assist you in making your products more manufacturable thus achieving maximum yields.

The guidelines include:

Wafer Thinning/Individual Die Thinning

Wafer Dicing/Dice Before Grind (DBG)

Die Pick-n-Place

Automated Visual Inspection

Die Attach

Flip Chip Assembly

Wire bond Assembly

Die Tape & Reel Capability

Chip-on-Board (COB) Assembly

Quad Flat No-Lead (QFN) and BGA Assembly

Laser Mark & Seam Seal

SiPho Fiber Connection

2022 Assembly Services Guide (