How Is the Printed Circuit Board (PCB) Manufacturing Process Done? The Complete Guide for 2026

Every electronic device contains printed circuit boards. The PCB manufacturing process is carried out in stages that directly affect the quality and long-term reliability of the final product. A small error in any stage can impair the board’s function and cause field failures. In this guide, we’ll cover every step in the manufacturing process and explain what’s important to know.

What Is a Printed Circuit Board and Why Is the Manufacturing Process Critical?

Printed circuit boards (PCB – Printed Circuit Board) are the physical foundation of every modern electronic system. A printed circuit board is a board made of insulating material with copper conductive traces that connect electronic components. Without a properly functioning PCB, the device simply won’t work.

The manufacturing process affects every aspect of the board:

• Inaccurate conductive traces cause electrical problems and electromagnetic interference.
• Holes in wrong positions prevent proper component assembly.
• Poor plating leads to corrosion and failures over time.
• Defective layers cause shorts or disconnections.

Critical industries have particularly stringent requirements. The medical field requires absolute reliability for life-saving devices, the defense sector requires durability under extreme conditions of temperature, humidity, and vibration. The semiconductor field requires micron-level precision.

Types of Printed Circuit Boards and Choosing the Right Structure

Before starting production, you need to choose the right board type for the application. The choice affects all stages of the process.

• Single Layer Board – One copper layer on one side of the board. Suitable for simple circuits with few components. Low cost and short production time.
• Double Layer Board – Copper layers on both sides of the board. Allows greater complexity. Most common in commercial applications.
• Multi-Layer Board – From 4 to 50+ layers. Required for complex circuits with high component density. Common in medical devices, defense systems, and advanced electronics.
• Flex PCB – Made of flexible material to allow bending. Suitable for applications with space constraints or need for mechanical flexibility.
• Rigid-Flex Board – Combination of rigid and flexible areas in one board. Solves complex connection challenges.

PCB Design and Layout Creation

The first step in PCB manufacturing is computer-aided design. Engineers use specialized CAD software like Altium Designer, KiCad, or OrCAD to design the board. They define the conductive traces, component placement, and layer arrangement.

Accurate design at this stage saves problems later. Any error in the layout will only be discovered after manufacturing, and correction at a late stage costs much more money and time.

Designers need to consider several factors:

• Trace width and spacing between them (according to required current).
• Optimal component placement to prevent interference.
• Heat management and energy dissipation in high-power circuits.
• Adaptation to the factory’s manufacturing capabilities (DFM – Design for Manufacturing).
• Compliance with IPC industry standards.

Preparing Manufacturing Files (Gerber Files) and Transfer to Factory

Gerber files are the common language between the designer and the factory. This is the industry standard format for precise description of the board structure. Every layer, every hole, and every coating is documented in these files.

Factories use Gerber files as work plans, so it’s important to check the files using Gerber Viewer software before sending to production.

The files include information about:

• Copper layers and conductive traces (Copper Layers).
• Drill positions and dimensions (Drill Files).
• Solder mask and protection areas (Solder Mask).
• Markings and labels on the board (Silkscreen).
• Outline and cutting lines (Board Outline).

Choosing the Base Material

The base material from which the board is made affects electrical, thermal, and mechanical performance. The choice depends on the application.

• FR-4 – The most common material. Glass fiber reinforced epoxy resin. Suitable for most commercial applications. Different Tg (glass transition temperature) versions exist – Tg130, Tg170, Tg180 for high-temperature applications.
• Rogers/Teflon – Materials with low and stable dielectric constant. Required for RF and high-frequency applications.
• Ceramic – High thermal conductivity. Suitable for high-power and LED applications.
• Polyimide – Flexible material resistant to high temperatures. Used for flexible boards.

Copper thickness is measured in ounces per square foot (oz/ft²). Standard thickness is 1oz (35 microns). Applications with high currents require 2oz or more.

Building PCB Layers and the Etching Process

At this stage, the layers are printed and connected to each other. A multi-layer board can contain dozens of layers, and each layer undergoes a separate process.

• Lamination – Copper layers combined with insulating material are stacked and bonded under pressure and heat. The process creates a uniform solid structure.
• Imaging – The trace design is transferred to the copper layer using photoresist coating and UV light exposure. The exposed areas (or unexposed, depending on type) harden and protect the copper beneath them.
• Etching – The board is immersed in a chemical solution that removes the exposed copper. Only the planned conductive traces remain on the board. Precision in etching ensures a proper and reliable circuit.

Drilling and Hole Plating for Inter-Layer Conductivity

In the drilling stage, holes are drilled for components and connections between layers, using precision CNC drilling machines that achieve accuracy levels of single microns.

Types of holes:

• Through Hole – Holes that pass through the entire board. For component mounting or connection between layers.
• Blind Via – Holes that start from an outer layer and reach an inner layer.
• Buried Via – Holes that connect inner layers only.
• Micro Via – Tiny holes with diameter below 150 microns. Created by laser.
• PTH (Plated Through Hole) coating – The holes are coated with a thin copper layer that allows current flow between layers. The process includes chemical activation followed by galvanic plating.

Surface Finish and Solder Mask

Surface finish protects exposed copper and prepares the board for component soldering. The choice affects solderability, shelf life, and cost.

Common coating types:

• HASL (Hot Air Solder Leveling) – Molten tin coating at low cost, suitable for most applications. A lead-free version exists (Lead-Free HASL).
• ENIG (Electroless Nickel Immersion Gold) – Nickel and gold providing high durability and flat surface. A suitable solution for components with tight spacing like pogo pins.
• OSP (Organic Solderability Preservative) – Organic and environmentally friendly coating at low cost, providing shorter shelf life.
• Immersion Silver/Tin – Silver or tin coating, for good performance at medium cost.

The solder mask is a protective lacquer layer that covers the traces and leaves only soldering areas exposed. The mask prevents shorts during assembly and protects against corrosion. Silkscreen printing can also be done, printing markings, labels, and component numbers on the board that assist in assembly and troubleshooting.

Quality Testing and Dimensional Control During Manufacturing

Quality testing is performed throughout the entire manufacturing process. We don’t wait until the end. Each stage is tested separately before moving to the next stage.

Optical inspections:

• AOI (Automated Optical Inspection) – High-speed cameras scan the board and compare to the original design, identifying defects, shorts, and disconnections.
• Visual inspection – Experienced technicians examine the board with the naked eye and microscope.

Electrical tests:

• Flying Probe – Moving probes test the circuit point by point. Testing suitable for small quantity production and prototypes.
• Bed of Nails / Fixture Testing – Dedicated fixture with fixed probes. Faster, suitable for mass production.
• Additional tests:
• X-Ray inspection – For checking hidden connections and BGA.
• Microscopic measurements of dimensions and layer thickness.
• Reliability testing under extreme conditions (temperature, humidity).
• IPC standards compliance testing.

Factors Affecting Lead Times and Cost

Production times depend on several factors:

• Board complexity – Number of layers, hole types, required precision level.
• Quantity – Prototype or small batch versus mass production.
• Special materials – Non-standard materials extend the time.
• Required testing – More comprehensive testing takes time.

A simple double-layer board can be ready within 24-48 hours. Complex multi-layer boards for defense and medical industries may require weeks.

Factors affecting production cost:

• Number of boards in the order.
• Board dimensions and number of layers.
• Coating type and materials.
• Required precision level.
• Testing and documentation requirements.

Admati Agencies: Expert Partner for PCB Manufacturing

Admati Agencies is a leading company with over 40 years of experience in electronic components. We provide complete solutions for medical, defense, and semiconductor industries. Our customers include leading companies like Intel, Qualcomm, and Medtronic.

We offer PCB manufacturing services of the highest quality, with rigorous quality control at every stage. Additionally, we supply complementary components for electronic systems such as pogo pins, ICT pins, connectors and sockets for testing and connection processes, as well as precision machining services for mechanical components.

We accompany customers from development to mass production, with professional technical consulting at every stage. Contact us for a quote.

Frequently Asked Questions

What is the difference between a single-layer and multi-layer PCB?

A single-layer board contains one copper layer and is suitable for simple applications with few components. A multi-layer board is built from multiple layers (4 to 50+) bonded together, allowing greater complexity and component density. Medical and defense industries mainly use multi-layer boards due to performance and reliability requirements.

What are Gerber files and why are they important?

Gerber files are the industry standard format for transferring PCB design to the manufacturing plant. They describe all board layers, drill positions, solder masks, and surface finishes. Without accurate Gerber files, the board cannot be manufactured, so it’s important to check them carefully in Gerber Viewer software before sending to production.

Which surface finish is suitable for medical products?

For medical products, ENIG (Electroless Nickel Immersion Gold) coating based on nickel and gold is recommended. It provides flat surfaces for components with tight spacing, high durability over time, and excellent solderability even after extended storage. ENIG coating meets the stringent reliability requirements of the medical industry and is also suitable for defense applications.

How long does it take to manufacture a PCB?

Production time depends on board complexity and quantity. A simple double-layer board can be ready within 24-48 hours with express service. Standard multi-layer boards take 5-10 business days. Complex boards for defense and medical industries, with special materials and comprehensive testing, may require 2-4 weeks.

What is the difference between Flying Probe and Fixture testing?

Flying Probe testing uses moving probes that test the circuit point by point. It’s flexible and doesn’t require a dedicated fixture, suitable for prototypes and small quantities. Fixture testing (Bed of Nails) uses a dedicated fixture with fixed probes, significantly faster and suitable for mass production when the initial fixture cost pays off.

What is FR-4 material and when should you choose a different material?

FR-4 is the standard material for PCB manufacturing – glass fiber reinforced epoxy resin. It’s suitable for most commercial and industrial applications. You should choose a different material when there are special requirements: Rogers materials for RF and high-frequency applications, ceramics for high-power applications with heat dissipation requirements, or Polyimide for flexible boards.

What are IPC standards and why are they important?

IPC standards are the international standards for the electronics industry that define quality requirements, manufacturing processes, and testing. Standards like IPC-A-600 (acceptability criteria for boards), IPC-6012 (specification for rigid boards), and IPC-A-610 (acceptability criteria for assemblies) ensure uniformity and quality between different manufacturers. In critical industries like medical and defense, compliance with IPC standards is a threshold requirement.

What is DFM and what is its importance in PCB design?

DFM (Design for Manufacturing) is the process of adapting the design to the factory’s manufacturing capabilities. It includes checking minimum trace width, spacing between traces, hole size, clearance between holes and copper, and more. Design that doesn’t consider DFM can cause manufacturing problems, delays, and additional costs. Most factories offer DFM review before starting production.