News

Integra’s Frequently Asked Questions about Die Attach…

Die attach is the foundation of the assembly process; it is the first critical step in the process and getting it right is essential for a reliable finished product.

Learn more about Die-Attach processes available at Integra in our February FAQ.


Have questions for our engineering team?

Let us know:[email protected]

 

More News Articles

Boston Semi Equipment Authorized by ASML as Exclusive Spare Parts Supplier for PAS2500/5000 Systems

BILLERICA, Mass. – May 27, 2015 – Boston Semi Equipment (BSE) today announced that it is the exclusive, ASML-authorized, source for spare parts on ASML’s PAS2500/5000 systems as of May 1, 2015. BSE will sell the parts through its worldwide sales channels and via its Kosaria e-commerce site. Spares will be shipped from BSE’s climate controlled warehouse located in Tempe,…

Integra Technologies’ Assembly Service Guide

Integra Technologies Inc. – Assembly Service Guide *September 2022* Learn how to make your products cost effective and designed for manufacture through the help of this detailed guide! Our guidelines are provided to assist you in making your products more manufacturable thus achieving maximum yields. The guidelines include: Wafer Thinning/Individual Die Thinning Wafer Dicing/Dice Before Grind (DBG) Die Pick-n-Place Automated…

Admati to Host its 4th Biannual Semiconductor Seminar

Once again Admati is hosting its bi-annual Semiconductor Technical Seminar. As in years past, the seminar will take place in the Tel-Aviv Hilton, and will be an opportunity for Semi’s professional to meet again. The seminar will take place in April 28th,and will start at 8:30 and end at 17:00. Mr. Admati, Admati’s Chairman and Owner, said “as always the…

Boston Semi Equipment’s Odyssey Takes the EG2001 Wafer Probe Platform into the Future

BILLERICA, Mass. – July 14, 2015 – Boston Semi Equipment (BSE) today announced its new Odyssey model wafer prober for 2-inch to 8-inch and custom geometry wafers. The Odyssey takes the proven mechanisms of the EG2001, supports them with enhanced software and electronics, and delivers a fully EG2001 compatible platform that is able to accommodate present and future probe requirements….